Samsung Electronics Wins $200bn Broadcom AI Chip Partnership — Announced After Korean Close, Sets Up Monday Open
Samsung Electronics and Broadcom agreed to a $200 billion collaboration spanning custom AI accelerator chips, HBM memory, and foundry manufacturing at an AI summit in San Francisco. The deal is the largest single AI infrastructure commitment to Samsung's foundry and memory businesses to date, directly validating Samsung's HBM3E ramp-up strategy and positioning it as the critical supply-chain partner for Broadcom's next-generation AI ASIC designs. Since the announcement hit after the 3:30pm KST Korean close, KOSPI participants who sold Samsung and SK Hynix today were operating without this information — Monday's opening auction will be the first pricing of this news, and a 3-5% gap-up for Samsung Electronics on open is a reasonable base case if US overnight sentiment holds.
Read at Business Times SG ↗