HBM base-substrate competition: where Samsung vs SK Hynix is really decided
A Chosun Ilbo tech analysis highlights that advanced HBM performance competition is now centered on the base substrate — the bottom die in the HBM stack that manages power delivery and thermal dissipation. This is the unsexy but critical battleground: Samsung's DRAM process advantage at the logic layer is partially offset by SK Hynix's lead in packaging and substrate thermal management, which is why SK Hynix's HBM3E has commanded a premium in Nvidia-certified supply. For Korean tech investors, this substrate-level competition matters because it determines which supplier locks in multi-generation purchase agreements with TSMC-ecosystem AI chipmakers — a winner-take-most dynamic where second place means margin compression, not just volume share loss.
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