SK Hynix Indiana HBM fab groundbreaking: ₩5.5T, 2029 production target
SK Hynix broke ground at its West Lafayette, Indiana facility Thursday—an advanced-packaging HBM fab targeting ₩5.5 trillion ($4 billion) in capex, with 2028 completion and 2029 production start for annual output in the 'hundreds of thousands' of wafers. With Nvidia guiding $108B for Q3, the timing is near-perfect: SK Hynix will be the only HBM supplier with US-based production when the fab comes online, locking in strategic supply-chain relationships that Micron cannot match by 2029. The Indiana plant converts what was cornfields 18 months ago into the central node of AI memory supply for the US market—a signal of the depth of Samsung-SK Hynix-TSMC America's long-term capex cycle.
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