Samsung's zHBM: 8x Performance Chip Challenges SK Hynix
Samsung Electronics revealed its zHBM (vertically-stacked HBM) chip at a technical event, claiming an 8x performance improvement over the current HBM3e generation through vertical die stacking — a manufacturing technique that enables dramatically higher bandwidth density within the same power envelope. This matters for the AI chip ecosystem: Nvidia's next GPU generation (Blackwell Ultra and beyond) requires HBM4 with higher bandwidth, and Samsung's zHBM technology is the company's attempt to close the technology gap with SK Hynix, which currently supplies the majority of HBM3e to Nvidia's H-series GPUs. If Samsung's zHBM passes Nvidia qualification testing, the HBM supply concentration risk at SK Hynix would rapidly diminish, compressing SK Hynix's pricing power and margin premium.
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